Gate trench power semiconductor devices having improved deep shield connection patterns

ABSTRACT

A power semiconductor device comprises a semiconductor layer structure having a wide band-gap drift region having a first conductivity type, a gate trench having first and second opposed sidewalls that extend in a first direction in an upper portion of the semiconductor layer structure, first and second well regions having a second conductivity type in the upper portion of the semiconductor layer structure, the first well region comprising part of the first sidewall and the second well region comprising part of the second sidewall. A deep shielding region having the second conductivity type is provided underneath the gate trench, and a plurality of deep shielding connection patterns that have the second conductivity type are provided that electrically connect the deep shielding region to the first and second well regions. The deep shielding connection patterns are spaced apart from each other along the first direction.

FIELD OF THE INVENTION

The present invention relates to power semiconductor devices and, moreparticularly, to power semiconductor devices having gate trenches and tomethods of fabricating such devices.

BACKGROUND

A Metal Insulating Semiconductor Field Effect Transistor (“MISFET”) is awell-known type of semiconductor transistor that may be used as aswitching device. A MISFET is a three terminal device that has gate,drain and source terminals and a semiconductor body. A source region anda drain region are formed in the semiconductor body that are separatedby a channel region, and a gate electrode (which may act as the gateterminal or be electrically connected to the gate terminal) is disposedadjacent the channel region. A MISFET may be turned on or off byapplying a bias voltage to the gate electrode. When a MISFET is turnedon (i.e., it is in its “on-state”), current is conducted through thechannel region of the MISFET between the source region and drainregions. When the bias voltage is removed from the gate electrode (orreduced below a threshold level), the current ceases to conduct throughthe channel region. An n-type MISFET has n-type source and drain regionsand a p-type channel. An n-type MISFET thus has an “n-p-n” design. Ann-type MISFET turns on when a gate bias voltage is applied to the gateelectrode that is sufficient to create a conductive n-type inversionlayer in the p-type channel region that electrically connects the n-typesource and drain regions, thereby allowing for majority carrierconduction therebetween. The gate electrode of a power MISFET istypically separated from the channel region by a thin gate dielectriclayer. A P-type MISFET has an “p-n-p” design and turns on when a gatebias voltage is applied to the gate electrode that is sufficient tocreate a conductive p-type inversion layer in the n-type channel regionthat electrically connects the p-type source and drain regions.

In some applications, MISFETs may need to carry large currents and/or becapable of blocking high voltages. Such MISFETs are often referred to as“power” MISFETs. Power MISFETs are often fabricated from wide band-gapsemiconductor materials, such as silicon carbide (“SiC”) or galliumnitride (“GaN”) based semiconductor materials. Herein, a wide band-gapsemiconductor material refers to a semiconductor material having aband-gap greater than 1.40 eV. Typically, power MISFETs implement thethin gate dielectric layer using an oxide layer such as a silicon oxidelayer. A power MISFET that includes an oxide gate dielectric layer isreferred to as a Metal Oxide Semiconductor Field Effect Transistor(“MOSFET”).

Power semiconductor devices can have a lateral structure or a verticalstructure. In a device having a lateral structure, the terminals of thedevice (e.g., the drain, gate and source terminals for a power MOSFETdevice) are on the same major surface (i.e., top or bottom) of asemiconductor layer structure. In contrast, in a device having avertical structure, at least one terminal is provided on each majorsurface of the semiconductor layer structure (e.g., in a vertical MOSFETdevice, the source may be on the top surface of the semiconductor layerstructure and the drain may be on the bottom surface of thesemiconductor layer structure). The semiconductor layer structure may ormay not include an underlying substrate such as a growth substrate.Herein, the term “semiconductor layer structure” refers to a structurethat includes one or more semiconductor layers, such as semiconductorsubstrates and/or semiconductor epitaxial layers.

A conventional power semiconductor device typically has a semiconductorsubstrate, such as a silicon carbide substrate having a firstconductivity type (e.g., an n-type substrate), on which an epitaxiallayer structure having the first conductivity type (e.g., n-type) isformed. A portion of this epitaxial layer structure (which may compriseone or more separate layers) functions as a drift region of the powersemiconductor device. The device typically includes an “active region,”which includes one or more power semiconductor devices that have ajunction such as a p-n junction. The active region may be formed onand/or in the drift region. The active region acts as a main junctionfor blocking voltage in the reverse bias direction and providing currentflow in the forward bias direction. The power semiconductor device mayalso have an edge termination in a termination region that is adjacentthe active region. One or more power semiconductor devices may be formedon the substrate, and each power semiconductor device will typicallyhave its own edge termination. After the substrate is fully processed,the resultant structure may be diced to separate the individualedge-terminated power semiconductor devices. The power semiconductordevices may have a unit cell structure in which the active region ofeach power semiconductor device includes a plurality of individual “unitcell” devices that are electrically connected in parallel and thattogether function as a single power semiconductor device.

Vertical power semiconductor devices that include a MOSFET transistorcan have a standard gate electrode design in which the gate electrode ofthe transistor is formed on top of the semiconductor layer structure or,alternatively, may have the gate electrode buried in a trench within thesemiconductor layer structure. MOSFETs having buried gate electrodes aretypically referred to as gate trench MOSFETs. With the standard gateelectrode design, the channel region of each unit cell transistor ishorizontally disposed underneath the gate electrode. In contrast, in thegate trench MOSFET design, the channel is vertically disposed. Gatetrench MOSFETs may provide enhanced performance, but typically require amore complicated manufacturing process.

SUMMARY

Pursuant to some embodiments of the present invention, powersemiconductor devices are provided that include a semiconductor layerstructure comprising a drift region that comprises a wide band-gapsemiconductor material, the drift region having a first conductivitytype, a gate trench in an upper portion of the semiconductor layerstructure, the gate trench having a longitudinal axis that extends in afirst direction and comprising first and second opposed sidewalls thateach extend parallel to the longitudinal axis, first and second wellregions having a second conductivity type that is different from thefirst conductivity type in the upper portion of the semiconductor layerstructure above the drift region, the first well region comprising partof the first sidewall and the second well region comprising part of thesecond sidewall, a deep shielding region having the second conductivitytype in the semiconductor layer structure underneath the gate trench,and a plurality of deep shielding connection patterns that have thesecond conductivity type in the upper portion of the semiconductor layerstructure, the deep shielding connection patterns spaced apart from eachother along the first direction, each deep shielding connection patternextending in a second direction that is different from the firstdirection, each deep shielding connection pattern establishing part ofthe first sidewall of the gate trench and establishing part of thesecond sidewall of the gate trench. The deep shielding connectionpatterns electrically connect the deep shielding region to the first andsecond well regions.

In some embodiments, the power semiconductor device further comprises aplurality of semiconductor channel regions that have the secondconductivity type in the first and second sidewalls of the gate trench,the semiconductor channel regions positioned between adjacent deepshielding connection patterns.

In some embodiments, the power semiconductor device further comprisesfirst and second source regions having the first conductivity type ontop of the respective first and second well regions.

In some embodiments, the deep shielding connection patterns have ahigher doping concentration than the first and second well regions. Insome embodiments, the deep shielding connection patterns extend to anupper surface of the semiconductor layer structure. In some embodiments,the deep shielding connection patterns sub-divide the first sourceregion into a plurality of spaced apart segments and sub-divide thesecond source region into a plurality of spaced apart segments. In someembodiments, portions of the deep shielding region that are alignedalong the second direction with the respective deep shielding connectionpatterns have higher doping concentrations of second conductivity typedopants than do the remainder of the deep shielding region.

In some embodiments, the power semiconductor device further comprises agate insulation layer in the gate trench that covers a bottom surfaceand the first and second sidewalls of the gate trench, a gate electrodein the gate trench on the gate insulation layer, a first source/draincontact that directly contacts the first source region, the secondsource region and the deep shielding connection patterns, and a secondsource/drain contact on a lower surface of the semiconductor layerstructure.

In some embodiments, the second direction is substantially perpendicularto the first direction.

In some embodiments, the wide band-gap semiconductor comprises siliconcarbide.

In some embodiments, the power semiconductor device further comprises anadditional plurality of gate trenches in the upper portion of thesemiconductor layer structure, each of the additional plurality of gatetrenches comprising respective first and second opposed sidewalls thatextend in the first direction and an additional plurality of deepshielding regions having the second conductivity type in thesemiconductor layer structure underneath the respective additionalplurality of gate trenches. In such embodiments, each deep shieldingconnection pattern extends continuously in the second direction and isformed in both the first sidewall and the second sidewall of each of therespective additional plurality of gate trenches. The semiconductordevice may further include an additional plurality of semiconductorchannel regions that have the second conductivity type in the first andsecond sidewalls of the respective additional plurality of gatetrenches, the semiconductor channel regions positioned between adjacentdeep shielding connection patterns in each of the additional pluralityof gate trenches.

In some embodiments, the first and second source regions completelycover top surfaces of the respective first and second well regions.

Pursuant to further embodiments of the present invention, powersemiconductor devices are provided that a semiconductor layer structurecomprising a drift region that comprises a wide band-gap semiconductormaterial having a first conductivity type, a plurality of gate trenchesin an upper portion of the semiconductor layer structure, each gatetrench having a longitudinal axis that extends in a first direction andcomprising first and second opposed sidewalls that each extend in thefirst direction, a plurality of source trenches in an upper portion ofthe semiconductor layer structure, each source trench having alongitudinal axis that extends in a second direction that is differentfrom the first direction and comprising first and second opposedsidewalls that each extend in the second direction, and a plurality ofdeep shielding regions having the second conductivity type in thesemiconductor layer structure underneath the respective source trenches.

In some embodiments, a metal source contact extends into the sourcetrenches.

In some embodiments, the power semiconductor device further comprises aplurality of additional deep shielding regions having the secondconductivity type in the semiconductor layer structure underneath therespective gate trenches.

In some embodiments, each gate trench comprises a segmented gate trenchthat comprises a plurality of spaced apart collinear gate trenchsegments.

In some embodiments, each source trench comprises a segmented sourcetrench that comprises a plurality of spaced apart collinear sourcetrench segments. In some embodiments, each source trench comprises acontinuous source trench. In some embodiments, each source trenchcomprises a segmented source trench that comprises a plurality of spacedapart collinear source trench segments.

In some embodiments, each gate trench comprises a segmented gate trenchthat comprises a plurality of spaced apart collinear gate trenchsegments. In some embodiments, each gate trench comprises a continuousgate trench.

In some embodiments, the semiconductor layer structure further comprisesa plurality of well regions having a second conductivity type that isdifferent from the first conductivity type, the well regions on an uppersurface of the drift region, and wherein the metal source contactelectrically connects the deep shielding regions to the well regions.

In some embodiments, the power semiconductor device further comprises asource region having the first conductivity type on an upper surface ofthe well region.

In some embodiments, the power semiconductor device further comprises agate electrode in each gate trench and a dielectric pattern thatelectrically insulates sidewalls of the gate electrodes from the metalsource contact.

In some embodiments, the second direction is substantially perpendicularto the first direction.

In some embodiments, the wide band-gap semiconductor comprises siliconcarbide.

Pursuant to still further embodiments of the present invention, powersemiconductor devices are provided that include a semiconductor layerstructure comprising a drift region that comprises a wide band-gapsemiconductor material, the drift region having a first conductivitytype, a gate trench in an upper portion of the semiconductor layerstructure, the gate trench having a longitudinal axis that extends in afirst direction and comprising first and second opposed sidewalls thateach extend in the first direction, a first gate electrode on the firstsidewall of the gate trench, a second gate electrode on the secondsidewall of the gate trench, and a source contact in the gate trenchbetween the first and second gate electrodes.

In some embodiments, the power semiconductor device further comprises afirst gate dielectric layer between the first sidewall of the gatetrench and the first gate electrode and a second gate dielectric layerbetween the second sidewall of the gate trench and the second gateelectrode.

In some embodiments, the power semiconductor device further comprises adeep shielding region having the second conductivity type in thesemiconductor layer structure underneath the gate trench.

In some embodiments, a portion of the source contact that is within thegate trench directly contacts the deep shielding region.

In some embodiments, the power semiconductor device further comprisesfirst and second well regions having a second conductivity type that isdifferent from the first conductivity type in the upper portion of thedrift region on opposed sides of the gate trench and first and secondsource regions having the first conductivity type in upper portions ofthe respective first and second well regions.

In some embodiments, the power semiconductor device further comprises afirst inter-metal dielectric layer that is in the gate trench betweenthe first gate electrode and the source contact and a second inter-metaldielectric layer that is in the gate trench between the second gateelectrode and the source contact.

In some embodiments, the source contact comprises a metal source contactand is also directly on the first and second source regions.

In some embodiments, the first gate dielectric layer extends between thedeep shielding region and the first gate electrode, and the seconddielectric layer extends between the deep shielding region and thesecond gate electrode.

In some embodiments, the first inter-metal dielectric layer directlycontacts the first source region and the second inter-metal dielectriclayer directly contacts the second source region.

In some embodiments, the first and second inter-metal dielectric layersdirectly contact the deep shielding region.

In some embodiments, the source contact comprises a continuous sourcecontact that extends between the first and second gate electrodes forsubstantially a length of the gate trench.

In some embodiments, the source contact comprises a metal pattern thatextends on top of the semiconductor layer structure that comprises aplurality of spaced apart downwardly extending plugs that extend intothe gate trench.

Pursuant to additional embodiments of the present invention, methods offabricating a semiconductor device are provided in which a semiconductorlayer structure comprising a wide band-gap semiconductor material isprovided, the semiconductor layer structure comprising a drift regionhaving a first conductivity type and a well layer having a secondconductivity type that is different from the first conductivity type,the well layer on an upper surface of the drift region. A gate trench isformed in an upper portion of the semiconductor layer structure, thegate trench having a longitudinal axis that extends in a first directionand comprising first and second opposed sidewalls that extend parallelto the longitudinal axis, the gate trench dividing the well layer intoat least first and second well regions. A deep shielding region havingthe second conductivity type is provided in the semiconductor layerstructure underneath the gate trench. A plurality of spaced-apart deepshielding connection patterns that have the second conductivity type areformed in the well region and in the upper portion of the drift region,each deep shielding connection pattern extending in a second directionthat is different from the first direction, and each deep shieldingconnection pattern forming part of the first sidewall of the gate trenchand forming part of the second sidewall of the gate trench. The deepshielding connection pattern electrically connects the deep shieldingregion to the first and second well regions.

In some embodiments, the method further comprises forming a source layerhaving the first conductivity type on top of the well layer, whereinforming the gate trench divides the source layer into at least first andsecond source regions.

In some embodiments, the deep shielding connection patterns are formedprior to formation of the source region. In some embodiments, the deepshielding connection patterns divide each of the first and second sourceregions into a plurality of spaced-apart sub-regions that are separatedfrom one another by the deep shielding connection patterns. In someembodiments, the deep shielding connection patterns are formed prior toformation of the gate trench. In some embodiments, the deep shieldingconnection patterns are formed after formation of the first and secondsource regions.

In some embodiments, the method further comprises forming a mask on thesource region and within the gate trench and forming a plurality ofspaced-apart openings in the mask, each opening extending in the seconddirection and exposing a respective portion of the top surface of thefirst source region, a respective portion of the top surface of thesecond source region, respective portions of the first and secondsidewalls of each of the gate trenches, and a respective portion of thetop surface of each deep shielding region.

In some embodiments, forming the plurality of spaced-apart deepshielding connection patterns comprises, after forming the openings inthe mask, implanting second conductivity dopants into the exposedportions of the first and second sidewalls of each of the gate trenchesand into the exposed portions of the top surfaces of the deep shieldingregions.

In some embodiments, the second conductivity dopants are implanted intothe exposed portions of the first and second sidewalls of each of thegate trenches via first and second angled ion implantation steps.

In some embodiments, the first and second angled ion implantation stepsare performed at ion implantation energies of less than 300 kV.

In some embodiments, the second conductivity dopants are implanted intothe exposed portions of the first and second sidewalls of each of thegate trenches via an ion implantation step that is performedperpendicularly to an upper surface of the semiconductor layerstructure.

In some embodiments, the ion implantation step is performed at ion animplantation energy of at least 100 kV.

In some embodiments, a plurality of semiconductor channel regions thathave the second conductivity type are provided in the first and secondsidewalls of each of the gate trenches, the semiconductor channelregions positioned between adjacent deep shielding connection patterns.

In some embodiments, the deep shielding connection patterns extend to anupper surface of the semiconductor layer structure.

In some embodiments, portions of the deep shielding region that arealigned along the second direction with the respective deep shieldingconnection patterns have higher doping concentrations of secondconductivity type dopants than do the remainder of the deep shieldingregion.

Pursuant to yet additional embodiments of the present invention, methodsof fabricating a semiconductor device are provided in which asemiconductor layer structure comprising a wide band-gap semiconductormaterial is provided, the semiconductor layer structure comprising adrift region having a first conductivity type. A plurality of gatetrenches are formed in an upper portion of the semiconductor layerstructure, each gate trench having a longitudinal axis that extends in afirst direction and comprising first and second opposed sidewalls thatextend in the first direction. A plurality of source trenches are formedin an upper portion of the semiconductor layer structure, each sourcetrench having a longitudinal axis that extends in a second directionthat is different from the first direction and comprising first andsecond opposed sidewalls that extend in the second direction. Aplurality of deep shielding regions having a second conductivity typethat is different from the first conductivity type are formed in thesemiconductor layer structure underneath at least some of the sourcetrenches.

In some embodiments, the method further comprises forming a sourcecontact that comprises protrusions that extend into respective ones ofthe source trenches.

In some embodiments, the method further comprises forming a respectivegate electrode in each of the gate trenches.

In some embodiments, the protrusions directly contact the deep shieldingregions.

In some embodiments, each gate electrode comprises a plurality ofspaced-apart gate electrode segments.

In some embodiments, respective ones of the protrusions of the sourcecontact extend continuously in each of the source trenches, and whereineach of the protrusions of the source contact extends between arespective pair of gate electrode segments of each gate electrode.

In some embodiments, each of the protrusions comprises a plurality ofspaced-apart segments.

In some embodiments, the method further comprises forming additionaldeep shielding regions having the second conductivity type in thesemiconductor layer structure underneath at least some of the gatetrenches.

In some embodiments, the second direction is substantially perpendicularto the first direction.

Pursuant to still further embodiments of the present invention, methodsof fabricating a semiconductor device are provided in which asemiconductor layer structure comprising a wide band-gap semiconductormaterial is formed, the semiconductor layer structure comprising a driftregion having a first conductivity type. A gate trench is formed in anupper portion of the semiconductor layer structure, the gate trenchhaving a longitudinal axis that extends in a first direction andcomprising first and second opposed sidewalls that extend in the firstdirection. A first gate electrode is formed on the first sidewall of thegate trench. A second gate electrode is formed on the second sidewall ofthe gate trench. A source contact is formed in the gate trench betweenthe first and second gate electrodes.

In some embodiments, the method further comprises forming a first gatedielectric layer on the first sidewall of the gate trench prior toforming the first gate electrode and forming a second gate dielectriclayer on the second sidewall of the gate trench prior to forming thesecond gate electrode.

In some embodiments, the method further comprises forming a deepshielding region having the second conductivity type in thesemiconductor layer structure underneath the gate trench.

In some embodiments, the method further comprises forming first andsecond well regions having a second conductivity type that is differentfrom the first conductivity type in the upper portion of thesemiconductor layer structure on opposed sides of the gate trench andforming first and second source regions having the first conductivitytype in upper portions of the respective first and second well regions.

In some embodiments, the method further comprises forming an inter-metaldielectric layer that is in the gate trench between the first and secondgate electrodes.

In some embodiments, the source contact penetrates the inter-metaldielectric layer to directly contact the deep shielding region.

In some embodiments, the source contact comprises a metal source contactand is also directly on the first and second source regions.

In some embodiments, the first gate dielectric layer is between the deepshielding region and the first gate electrode, and the second dielectriclayer is between the deep shielding region and the second gateelectrode.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1D are schematic cross-sectional views that illustrate a methodof fabricating a conventional gate trench power MOSFET.

FIGS. 2A-2D are schematic perspective views that illustrate a method offabricating a semiconductor layer structure of a gate trench powerMOSFET according to embodiments of the present invention.

FIGS. 2E and 2F are schematic cross-sectional views taken along lines2E-2E and 2F-2F of FIG. 2D, respectively, that illustratecross-sectional views of the gate trench power MOSFET of FIG. 2D aftermetallization has been formed on the semiconductor layer structure.

FIGS. 3A-3D are schematic perspective views that illustrate a method offabricating a semiconductor layer structure of a gate trench powerMOSFET according to further embodiments of the present invention.

FIGS. 3E and 3F are schematic cross-sectional views taken along lines3E-3E and 3F-3F of FIG. 3D, respectively, that illustratecross-sectional views of the gate trench power MOSFET of FIG. 3D aftermetallization has been formed on the semiconductor layer structure.

FIGS. 4A-4D are schematic perspective views that illustrate a method offabricating a semiconductor layer structure of a gate trench powerMOSFET according to still further embodiments of the present invention.

FIGS. 4E and 4F are schematic cross-sectional views taken along lines4E-4E and 4F-4F of FIG. 4D, respectively, that illustratecross-sectional views of the gate trench power MOSFET of FIG. 4D aftermetallization has been formed on the semiconductor layer structure.

FIGS. 4G and 4H are schematic perspective views that illustrate amodified version of the MOSFET 300 of FIGS. 4A-4F.

FIG. 5A is a perspective view of gate trench power MOSFET according toadditional embodiments of the present invention.

FIG. 5B is a schematic perspective view of a small region of the gatetrench power MOSFET of FIG. 5A.

FIGS. 5C and 5D are schematic perspective views of small portions ofrespective modified versions of the gate trench power MOSFET of FIG. 5A.

FIGS. 6A-6E are schematic perspective views that illustrate a method offabricating a gate trench power MOSFET according to still furtherembodiments of the present invention.

FIGS. 7-9 are flow charts illustrating methods of fabricating gatetrench power semiconductor devices according to embodiments of thepresent inventive concepts.

DETAILED DESCRIPTION

Silicon carbide based gate trench vertical power MOSFETs are attractivefor many applications due to their inherent lower specificon-resistance, which may result in more efficient operation for powerswitching operations. Gate trench vertical power MOSFETs exhibit lowerspecific resistance during on-state operation because the channel isformed in the sidewall of the gate trench. Moreover, the carriermobility in the sidewall channel of a gate trench MOSFET has been foundto be 2-4 times higher than the corresponding carrier mobility in thehorizontal channel of a standard (i.e., non-gate trench) vertical powerMOSFET. This increased channel mobility results in increased currentdensity during on-state operation allowing for higher switching speeds.Furthermore, the trench design reduces the overall pitch of the device,allowing for increased integration. The lower conduction losses (due tothe reduced on-state resistance) and improved switching speeds make gatetrench MOSFETs well-suited for high frequency power applications havinglow to moderate voltage blocking requirements (e.g., 600-1200 Volts).These devices may have reduced requirements for associated passivecomponents, low cost, low weight and require relatively simple coolingschemes.

Gate trench power MOSFETs are susceptible to oxide reliability issuesdue to the presence of high electric fields in the oxide gate dielectriclayer (also referred to herein as a gate oxide layer) that lines thebottom of the gate trench. The high electric fields degrade the gateoxide layer over time, and may eventually result in failure of thedevice. The highest electric fields occur in corner regions of the gateoxide layer where electric field crowding effects can dramaticallyincrease the levels of the electric field in the gate oxide layer. Whengate trench MOSFETs operate in reverse blocking operation, the highestelectric field levels occur at the corners of the gate oxide layer atthe bottom edges of the gate trench.

So-called “deep shielding regions” are often provided underneath thegate trenches of conventional gate trench power MOSFETs in order toreduce the electric field levels in the gate oxide layer during reverseblocking operation. These deep shielding regions comprise highly dopedsemiconductor layers having the same conductivity type as the channelregion. The deep shielding regions may, for example, extend downwardly0.5 to 1.0 microns or more from the bottom surface of the gate trenchinto the drift region of the device. The deep shielding regions may alsoextend laterally farther than the sidewalls of the trenches and/or mayextend along the lower sides of the trenches in some cases. The deepshielding regions are electrically connected to the source terminal ofthe MOSFET by deep shielding connection patterns. However, reliablyimplementing deep shielding regions and deep shielding connectionpatterns may be difficult.

FIGS. 1A-1D are schematic cross-sectional views illustrating a method offabricating a conventional silicon carbide-based gate trench verticalpower MOSFET 1.

As shown in FIG. 1A, the power MOSFET 1 includes a heavily-doped (n⁺)n-type silicon carbide substrate 10. A lightly-doped (n⁻) siliconcarbide drift region 20 is formed on the substrate 10 by epitaxialgrowth. A moderately-doped p-type silicon carbide well layer 30 isformed on the upper surface of the n-type drift region 20, either byepitaxial growth or by implanting p-type dopants into the upper portionof the n-type drift region 20. A heavily-doped n⁺ silicon carbide sourcepattern 40 is formed in upper portions of the p-type silicon carbidewell layer 30 by, for example, ion implantation. The silicon carbidesubstrate 10, drift region 20, well layer 30 and source pattern 40,along with the various regions/patterns formed therein, comprise asemiconductor layer structure 50 of the power MOSFET 1.

As shown in FIG. 1B, an etching process may be carried out to form aplurality of gate trenches 60 in the upper surface of the semiconductorlayer structure 50. Each gate trench 60 may extend laterally (i.e.,parallel to a major surface of the semiconductor layer structure) in afirst direction across the length (or width) of the power MOSFET 1. InFIGS. 1A-1D, the first direction is into the page and is indicated asbeing the x-direction. The gate trenches 60 may extend vertically (i.e.,perpendicular to a major surface of the semiconductor layer structure orin the z-direction) through the source pattern 40 and well layer 30, andinto the drift region 20, as shown, and the gate trenches 60 may bespaced apart from each other in a second direction (here the y-directionthat is perpendicular to the first direction. The gate trenches 60convert the moderately-doped p-type silicon carbide well layer 30 into aplurality of p-wells 32 and convert the heavily-doped n-type siliconcarbide source pattern 40 into a plurality of n-type source regions 42.The portions of each p-well 32 that are adjacent the gate trenches 60act as transistor channels 34, as will be discussed below. Heavily-dopedp⁺ silicon carbide deep shielding regions 70 are formed underneath eachgate trench 60 by ion implantation. The silicon carbide deep shieldingregions 70 may extend the full length of the respective gate trenches60.

As shown in FIG. 1C, an angled ion implantation may be performed usingan implant mask (not shown) to implant p-type dopants into one of thesidewalls (here the right sidewall) of each of the gate trenches 60. Asis further shown in FIG. 1C, this ion implantation step converts thelower n-type portion of each right sidewall of the gate trench 60 intoheavily-doped p-type deep shielding connection patterns 72. These deepshielding connection patterns 72 electrically connect each deepshielding region 70 to a p-well 32.

Referring to FIG. 1D, a gate oxide layer 62 is formed on the bottomsurface and sidewalls of each gate trench 60. A gate electrode 64 isformed on each gate insulating layer 62 to fill the respective gatetrenches 60. An inter-metal dielectric layer 66 is formed on the exposedportions of the gate electrode 64, and a source contact 80 is formed onthe upper portion of the device. The source contact 80 is physically andelectrically connected to the p-wells 32 and the n-type source regions42. The source contact 80 may comprise the source terminal of the MOSFET1 or may be electrically connected to the source terminal. A draincontact 82 is formed on the lower surface of the substrate 10. A gatecontact (not shown) is also provided that is connected to the gateelectrodes 64 outside the view of the cross-section of FIG. 1D.

The deep shielding region 70 may be effective in protecting the cornersof the gate insulating layer 62 from high electric fields during reverseblocking operation. Unfortunately, however, the deep shieldingconnection patterns 72 that electrically connect the source contact 80to the deep shielding regions 70 renders the transistor channels 34 onthe right sidewall of each gate trench 60 inoperable as there is non-type semiconductor material on the lower side of the channels 34.Thus, the deep shielding connection patterns 72 provide the necessaryelectrical connection between the deep shielding regions 70 and thesource contact 80, but sacrifice half of the transistor channel area ofthe MOSFET 1.

Pursuant to embodiments of the present invention, improved techniquesare disclosed for forming deep shielding connection patterns thatelectrically connect the deep shielding regions of a gate trench MISFETto the source contact thereof. The approaches disclosed herein maysacrifice less of the transistor channel area and hence may result inimproved device performance. As gate oxide layers are almost always useddue to their superior electrical properties, the discussion ofembodiments of the present invention below focuses on MOSFETs as opposedto MISFETs. It will be appreciated, however, that the describedembodiments may alternatively be implemented with gate dielectric layersformed with materials other than oxides. Any appropriate insulatingmaterial may be used (e.g., nitrides, oxy-nitrides, high dielectricconstant materials, etc.).

The MOSFETs according to embodiments of the present invention may havegate trenches that extend laterally in a first direction (thex-direction in the figures that follow). In some embodiments, stripes ofheavily-doped p-type material may be formed in the MOSFET that extendlaterally in a second direction across the gate trenches (they-direction in the figures that follow). For example, the stripes ofheavily-doped p-type material may extend perpendicularly to the gatetrenches. These stripes may extend to at least the depth of the p-typedeep shielding regions so as to electrically connect the deep shieldingregions to the p-wells, and hence to the source contact of the MOSFET.The stripes of heavily-doped p-type material may comprise, for example,perhaps 15% to 25% of the sidewalls of the gate trenches, and hence mayonly sacrifice about 15% to 25% of the total channel area of the device(as compared to 50% in the conventional MOSFET 1 discussed above).

Pursuant to further embodiments of the present invention, gate trenchpower MOSFETs are provided that include both gate trenches and sourcetrenches that cross the gate trenches. For example, the source trenchesmay extend perpendicularly to the gate trenches. Deep shielding regionsare formed underneath at least portions of the source trenches, and mayalso optionally be formed underneath the gate trenches. The sourcecontact may be formed in the source trenches so as to directly contactthe deep shielding regions. In some embodiments, the gate electrodes mayextend continuously in the respective gate trenches and the portions ofthe source contact that are in the source trenches may be segmented inorder to allow the gate electrodes and the source contact to “cross” inthe trenches. In other embodiments, the source contacts may extendcontinuously in the respective source trenches and the gate electrodesmay be segmented.

Pursuant to still further embodiments of the present invention, gatetrench power MOSFETs are provided that have source contacts that extendthrough the gate trenches to directly contact the deep shieldingregions. In these embodiments each gate electrode may include first andsecond gate electrode portions that extend along the two sidewalls of arespective one of the gate trenches, and the source contact may extendthrough a central portion of the gate trench between the first andsecond gate electrode portions. An inter-metal dielectric pattern mayalso be formed in each gate trench that electrically isolates the firstand second gate electrode portions from the portion of the sourcecontact that extends through the gate trench. The portions of the sourcecontact that extend into the respective source trenches may becontinuous portions that extend the full length of the respectivetrenches, or may be discrete plugs that extend into the respectivetrenches at periodic or non-periodic intervals.

The gate trench power MOSFETs according to embodiments of the presentinvention include reliable deep shielding connection patterns (orequivalent structures) that sacrifice less of the channel area of theMOSFET than do conventional deep shielding connection patternapproaches. Thus, the gate trench power MOSFETs according to embodimentsof the present invention may exhibit improved performance.

Embodiments of the present invention will now be described withreference to FIGS. 2A-9 . It will be appreciated that features of thedifferent embodiments disclosed herein may be combined in any way toprovide many additional embodiments. Thus, it will be appreciated thatvarious features of the present invention are described below withrespect to specific examples, but that these features may be added toother embodiments and/or used in place of example features of otherembodiments to provide many additional embodiments. Thus, the presentinvention should be understood to encompass these differentcombinations. Additionally, while the example embodiments focus onMOSFET implementations, it will be appreciated that the same techniquesmay be used in other gate trench power semiconductor devices such asinsulated gate bipolar transistors (IGBTs), gate controlled thyristorsand the like.

FIGS. 2A-2F are schematic diagrams that illustrate a gate trench powerMOSFET 100 according to embodiments of the present invention. Morespecifically, FIGS. 2A-2D are schematic perspective views thatillustrate a method of fabricating the semiconductor layer structure ofa gate trench power MOSFET 100, and FIGS. 2E and 2F are schematiccross-sectional views taken along lines 2E-2E and 2F-2F of FIG. 2D,respectively, that illustrate cross-sectional views of the gate trenchpower MOSFET 100 of FIG. 2D after metallization has been formed on thesemiconductor layer structure.

Referring to FIG. 2A, an n-type silicon carbide substrate 110 isprovided. The substrate 110 may comprise, for example, a 4H-siliconcarbide or a 6H-silicon carbide substrate. In other embodiments, thesubstrate 110 may be or comprise a different semiconductor material(e.g., a Group III nitride-based material, silicon, gallium arsenide,zinc oxide, etc.) or a non-semiconductor material (e.g., sapphire). Thesubstrate 110 may be heavily-doped with n-type impurities (i.e., an n⁺silicon carbide substrate). The impurities may comprise, for example,nitrogen or phosphorous. The doping concentration of the substrate 110may be, for example, between 1×10¹⁸ atoms/cm³ and 1×10²¹ atoms/cm³,although other doping concentrations may be used. The substrate 110 maybe relatively thick in some embodiments (e.g., 20-100 microns or more).It should be noted that while the substrates are shown in the figures asrelatively thin layers, this is done to allow enlargement of otherlayers and regions of the device, and it will be appreciated that thesubstrate will typically be much thicker than shown. The thickness ofvarious other layers of the MOSFETs according to embodiments of thepresent invention likewise may not be shown to scale in order to provideshowing enlarged views of various portions of the devices.

A lightly-doped (n⁻) silicon carbide drift region 120 may be provided onthe substrate 110. The n-type drift region 120 may be formed, forexample, by epitaxial growth on the substrate 110. The n-type driftregion 120 may have, for example, a doping concentration of 1×10¹⁶ to5×10¹⁷ dopants/cm³. The n-type drift region 120 may be a thick region,having a vertical height above the substrate 110 of, for example, 3-50microns. In some embodiments, an upper portion of the n-type driftregion 120 may comprise an n-type current spreading layer (not shown)that is more heavily doped than the lower portion of the n-type driftregion 120.

A moderately-doped p-type well layer 130 is formed on the upper surfaceof the n-type silicon carbide drift region 120. The moderately-dopedp-type well layer 130 may be formed, for example, by epitaxial growth orby ion implantation. The moderately-doped p-type well layer 130 may bedoped to a desired doping density for the transistor channels of thedevice. In some embodiments, the moderately-doped p-type well layer 130may have a doping concentration of, for example, between 1×10¹⁶atoms/cm³ and 1×10¹⁹ atoms/cm³. The moderately-doped p-type well layer130 may have a graded doping profile in some embodiments.

Referring to FIG. 2B, an implant mask (not shown) is formed on thestructure of FIG. 2A, and striped openings (not shown) are formed in themask. Then, a high energy, high dosage ion implantation process is usedto form stripes 171 of highly doped p-type material through themoderately-doped p-type well layer 130 and into the lightly-doped (n⁻)silicon carbide drift region 120. The stripes 171 of highly doped p-typematerial may extend at least as deep as gate trenches that are formed inthe structure in a later processing step.

Referring to FIG. 2C, a heavily-doped (n⁺) n-type silicon carbide sourcelayer 140 is formed in an upper region of the moderately-doped p-typewell layer 130 via ion implantation. The stripes 171 of highly dopedp-type material may be more heavily doped than the heavily-doped (n⁺)n-type silicon carbide source layer 140 in some embodiments. Forexample, the heavily-doped (n⁺) n-type silicon carbide source layer 140may have a doping concentration between 1×10¹⁹ atoms/cm³ and 5×10²¹atoms/cm³, with the doping concentration of the p-type stripes 171 beingat least 1.2 times higher than the doping concentration of the n-typesource layer 140. The above-described layers 110, 120, 130, 140 (andregions formed therein such as the stripes 171 and the p-type deepshielding regions described below) comprise a semiconductor layerstructure 150 of MOSFET 100.

Referring to FIG. 2D, a plurality of gate trenches 160 are formed viaetching in an upper surface of the semiconductor layer structure 150.Although only one gate trench 160 (and portions of two others) is shownin FIG. 2D, it will be appreciated that a large number of gate trenches160 are typically provided, where each gate trench 160 extends in afirst direction above the substrate 110 (here the gate trenches extendin the x-direction), and the gate trenches 160 are spaced apart fromeach other in a second direction (here the y-direction) so that the gatetrenches 160 extend in length parallel to each other. Each gate trench160 has a length (corresponding to a distance in the x-direction), awidth (corresponding to a distance in the y-direction), and a depth(corresponding to a distance in the z-direction). The length directionis the longest direction, and hence The longitudinal axis of each gatetrench 160 refers to an axis that extends in the length direction downthe middle of the gate trench 160. Herein, this length direction (thex-direction) may be referred to as a first direction. Each gate trench160 has first and second opposed sidewalls and a bottom surface thateach extend in the first direction and hence extend parallel to thelongitudinal axis. The stripes 171 extend in a second direction that isdifferent from the first direction so that the stripes 171 cross thegate trenches 160. In the depicted embodiment, the second direction isperpendicular to the first direction (i.e., the second direction is thewidth direction/y-direction, although embodiments of the presentinvention are not limited thereto.

Each gate trench 160 extends through the heavily-doped n-type siliconcarbide layer 140 in order to convert this silicon carbide layer into aplurality of spaced apart heavily-doped n-type silicon carbide regions142 that serve as the source regions of the power MOSFET 100. Each gatetrench 160 also extends through the moderately-doped p-type siliconcarbide layer 130 in order to convert this layer 130 into a plurality ofp-wells 132. Each gate trench 160 also extends into an upper surface ofthe n-type drift region 120. The sidewalls of each gate trench 160 arethe exposed surfaces of the layers/regions of the semiconductor layerstructure that are on either side of each gate trench 160. Thus thesource regions 142 and the upper portions of the stripes 171 mayform/establish the upper portion of each sidewall, the p-wells 132 andmiddle portions of the stripes 171 may form/establish the middle portionof each sidewall, and the drift region 120 and lower portions of thestripes 171 may form/establish the lower portion of each sidewall.

As is further shown in FIG. 2D, heavily-doped p⁺ silicon carbide deepshielding regions 170 are formed underneath each gate trench 160 byimplanting p-type dopants into the bottom surface of each gate trench160. The p-type deep shielding regions 170 may be formed via a highenergy, high dosage ion implantation step that converts the portions ofthe lightly-doped n-type drift region that are under the gate trenches160 into heavily doped p-type regions. The deep shielding regions 170may extend the full length of the respective gate trenches 160.

As is also shown in FIG. 2D, the stripes 171 of highly doped p-typematerial extend downwardly beyond the top surface of the deep shieldingregions 170, and hence are electrically connected to the deep shieldingregions 170. The stripes 171 thus act as deep shielding connectionpatterns 172 that electrically connect the deep shielding regions 170 tothe p-wells 132. Since the stripes 171/deep shielding connectionpatterns 172 extend to the top surface of the semiconductor layerstructure 150, the p-wells 132 need not extend to the top surface of thesemiconductor layer structure 150.

Referring to FIGS. 2E and 2F, a conformal gate oxide layer is formed onthe bottom surface and sidewalls of each gate trench 160. The conformalgate oxide layer may be formed by oxidizing the exposed silicon carbidevia an anneal in an oxygen containing environment. Alternatively, theconformal gate oxide layer may be formed by an oxide deposition step.Portions of the conformal gate oxide layer may be removed to formopenings where the source contact 180 can connect to the source regions140 and the deep shielding connection patterns 172. Removal of theseportions of the conformal gate oxide layer leaves a gate oxide layer 162in each gate trench 160.

A gate electrode 164 is formed on each gate oxide layer 162 to fill therespective gate trenches 160. The gate electrodes 164 may comprise aconductive material such as, for example, polysilicon, a silicate or ametal. An intermetal dielectric layer 166 is formed on the exposedportions of the gate oxide layers 162 and the gate electrodes 164, and asource contact 180 is formed on the upper portion of the device. Thesource contact 180 may comprise one or more metals and is physically andelectrically connected to the deep shielding connection patterns 172 andthe n-type source regions 140. The source contact 180 may comprise thesource terminal of the MOSFET 100 or may be electrically connected tothe source terminal. A drain contact 182 is formed on the lower surfaceof the substrate 110. A gate contact (not shown) is also provided thatis connected to the gate electrodes 164 outside the views of thecross-sections of FIGS. 2E and 2F.

The portions of the sidewalls of the gate trenches where the deepshielding connection patterns 172 (FIG. 2F) are formed are not operableas part of the transistor since they do not include an n-p-n junctionstructure adjacent a gate electrode. As shown in FIG. 2D, in someembodiments, the extent of the deep shielding connection patterns 172 inthe first direction (i.e., in the direction in which the gate trenches160 extend) may be only about 15%-25% of the extent of the regions ofthe sidewalls that are between the deep shielding connection patterns172. As such, only about 15%-25% of the channel region is sacrificed toprovide the deep shielding connection patterns 172 that electricallyconnect the deep shielding regions 170 to the source contact 180, ascompared to a sacrifice of 50% of the channel region in the conventionalMOSFET 1 of FIGS. 1A-1E. In other embodiments, the extent of the deepshielding connection patterns 172 in the first direction may be between10%-30%, between 10% and 40%, between 20% and 40% or between 30% and 40%of the extent of the regions of the sidewalls that are between the deepshielding connection patterns 172. All such embodiments may provideimproved performance as compared to the MOSFET 100 of FIGS. 1A-1D.

FIGS. 3A-3D are schematic perspective views that illustrate a method offabricating the semiconductor layer structure of a gate trench powerMOSFET 200 according to further embodiments of the present invention.FIGS. 3E and 3F are schematic cross-sectional views taken along lines3E-3E and 3F-3F of FIG. 3D, respectively, that illustratecross-sectional views of the gate trench power MOSFET 200 of FIG. 3Dafter metallization has been formed on the semiconductor layerstructure. The MOSFET 200 is similar to the MOSFET 100 described above,but may be fabricated using a low energy implant to form the deepshielding connection patterns thereof.

Referring to FIG. 3A, a heavily-doped (n⁺) n-type silicon carbidesubstrate 210 is provided, and a lightly-doped (n⁻) silicon carbidedrift region 220 is formed thereon via epitaxial growth. Amoderately-doped p-type well layer 230 is formed on the upper surface ofthe n-type silicon carbide drift region 220, and a heavily-doped (n⁺)n-type silicon carbide source layer 240 is formed on themoderately-doped p-type well layer 230. The substrate 210, drift region220, well layer 230 and source layer 240 comprise a semiconductor layerstructure 250. The layers 210, 220, 230, 240 may be formed in the samefashion and have the same characteristics (e.g., thickness, dopingdensities, etc.) as the corresponding layers of gate trench power MOSFET100 discussed above, so further description thereof will be omitted.

Referring to FIG. 3B, a plurality of gate trenches 260 are formed viaetching in an upper surface of the semiconductor layer structure 250.Each gate trench 260 extends in a first direction (the x-direction)above the substrate 210, and the gate trenches 260 are spaced apart fromeach other in a second direction (the y-direction). Each gate trench 260extends through the heavily-doped n-type silicon carbide layer 240 inorder to convert this silicon carbide layer 240 into a plurality ofspaced apart heavily-doped n-type regions 242. Each gate trench 260 alsoextends through the moderately-doped p-type silicon carbide layer 230 inorder to convert this layer 230 into a plurality of p-wells 232. Eachgate trench 260 also extends into an upper surface of the n-type driftregion 220.

As is further shown in FIG. 3B, heavily-doped p⁺ silicon carbide deepshielding regions 270 are formed underneath each gate trench 260 byimplanting p-type dopants into the bottom surface of each gate trench260. The p-type shielding patterns 270 may be formed via a high energy,high dosage ion implantation step that converts the portions of thelightly-doped n-type drift region that are under the gate trenches 260into heavily doped p-type regions. The deep shielding regions 270 mayextend the full length of the respective gate trenches 260.

Referring to FIG. 3C, a photoresist implant blocking mask 276 is formedon the structure of FIG. 3B, and the photoresist implant blocking mask276 is patterned to form a plurality of striped openings 278 therein. Apair of lower energy, high dosage angled ion implants are performed inorder to implant the opposed sidewalls of the gate trenches 260 that areexposed via the plurality of striped openings 278. The mask 276 may thenbe removed. Each lower energy, high dosage angled ion implants may beperformed, for example, at an implant energy of between 10 kV and 300 kVwith a dosage of between 1×10¹³ and 1×10¹⁵. In other exampleembodiments, the implant energy may be between 10 kV and 200 kV, between10 kV and 100 kV or between 50 kV and 100 kV in each case with a dosageof between 1×10¹³ and 1×10¹⁵.

Referring to FIG. 3D, the angled ion implantation step formsheavily-doped stripes 271 of p-type material in the exposed surfaces ofthe semiconductor layer structure 250. The stripes 271 extend in asecond direction (the y-direction) to cross the gate trenches 260. Thesecond direction may be perpendicular to the first direction (i.e., tothe direction in which the gate trenches 260 extend), as shown. Asshown, the stripes 271 may be formed in upper and side surfaces of thesource regions 240, in side surfaces of the p-wells 232 that are exposedby the gate trenches 260, in side surfaces of the drift region 220 thatare exposed by the gate trenches 260, and in the top surface of the deepshielding regions 270. The stripes 271 of highly doped p-type materialtherefore electrically connect the deep shielding regions 270 to thep-wells 232, and hence act as deep shielding connection patterns 272.Once again, since the deep shielding connection patterns 272 extend tothe top surface of the semiconductor layer structure 250, the p-wells232 need not extend to the top surface of the semiconductor layerstructure 250.

The deep shielding connection patterns 272 need not extend all the waythrough the sidewalls of the gate trenches 260, but instead may onlyextend in a surface region of the sidewalls and in surface regions ofthe top surfaces of the source regions 242 and the top surfaces of thedeep shielding regions 270 (see FIG. 3F). Consequently, a much lowerimplant energy may be used to form the deep shielding connectionpatterns 272 as compared to the deep shielding connection patterns 172,which may result in less damage to the semiconductor crystal.

Referring to FIGS. 3E and 3F, a gate oxide layer 262 is formed (e.g., byoxidation or deposition) on the bottom surface and sidewalls of eachgate trench 260, and gate electrodes 264 are formed on the gate oxidelayers 262 to fill the respective gate trenches 260. An inter-metaldielectric layer 266, a source contact 280 and a drain contact 282 arethen formed. The gate oxide layers 262, gate electrodes 264, inter-metaldielectric layer 266 source contact 280, and drain contact 282 may beformed in the same manner as described above with reference to FIGS. 2Eand 2F, and hence further description thereof will be omitted. Gatecontacts (not shown) may also be formed in a conventional manner.

As can be seen, the MOSFET 200 may be very similar to the MOSFET 100,with the primary difference being that the deep shielding connectionpatterns 272 are only formed along the upper and side surfaces of thegate trenches 260 and source regions 240 instead of extending completelythrough the pillars that define the gate trenches 260. As with MOSFET100 of FIGS. 2A-2F, the deep shielding connection patterns 272 mayoccupy only 15%-25% of the surface area of the sidewalls of the gatetrenches 260 in example embodiments. In other embodiments, the extent ofthe deep shielding connection patterns 272 in the first direction may bebetween 10%-30%, between 10% and 40%, between 20% and 40% or between 30%and 40% of the extent of the regions of the sidewalls of the gatetrenches 260 that are between the deep shielding connection patterns272. All such embodiments may provide improved performance as comparedto the MOSFET 100 of FIGS. 1A-1D.

FIGS. 4A-4D are schematic perspective views that illustrate a method offabricating a semiconductor layer structure of a gate trench powerMOSFET 300 according to still further embodiments of the presentinvention. FIGS. 4E and 4F are schematic cross-sectional views takenalong lines 4E-4E and 4F-4F of FIG. 4D, respectively, that illustratecross-sectional views of the gate trench power MOSFET 300 of FIG. 4Dafter metallization has been formed on the semiconductor layerstructure. The MOSFET 300 may be almost identical to the MOSFET 200described above, but is fabricated using a slightly different technique.

Referring to FIG. 4A, a semiconductor layer structure 350 is formed thatincludes a heavily-doped (n⁺) n-type silicon carbide substrate 310, alightly-doped (n⁻) silicon carbide drift region 320, a moderately-dopedp-type well layer 330, and a moderately-doped (n) n-type silicon carbidesource layer 340 that are sequentially stacked. The semiconductor layerstructure 350 may be identical to the semiconductor layer structure 250discussed above, except that the n-type silicon carbide source layer 340is not as heavily doped in this embodiment. For example, the n-typesilicon carbide source layer 340 may be doped to a concentration of lessthan 1×10²⁰ atoms/cm³.

Referring to FIG. 4B, a plurality of gate trenches 360 are formed thatmay be identical to the gate trenches 260 discussed above. The gatetrenches 360 convert the n-type silicon carbide layer 340 into aplurality of spaced apart n-type regions 342 and converts themoderately-doped p-type silicon carbide layer 330 into a plurality ofp-wells 332. Heavily-doped p⁺ silicon carbide deep shielding regions 370are formed underneath each gate trench 360 by ion implantation.

Referring to FIG. 4C, a photoresist implant blocking mask 376 is formedon the structure of FIG. 4B, and the photoresist implant blocking mask376 is patterned to form a plurality of striped openings 378 therein. Ahigher energy, high dosage non-angled (i.e., perpendicular to thesurface) ion implant is performed that further dopes the exposedportions of the deep shielding regions 370. The mask 376 may be removedonce the ion implantation step is completed. The high energy, highdosage ion implant may be performed, for example, at an implant energyof between 100 kV and 2000 kV with a dosage of between 1×10¹³ and1×10¹⁵. In other example embodiments, the implant energy may be between200 kV and 2000 kV, between 400 kV and 2000 kV or between 500 kV and2000 kV in each case with a dosage of between 1×10¹³ and 1×10¹⁵.

Referring to FIG. 4D, during the high energy ion implantation step shownin FIG. 4C, some of the p-type ions will reflect or “scatter” off thetop surface of the deep shielding region 370 and embed into the portionsof the sidewalls of the gate trenches 360 that are exposed by theopenings 378 in the mask 376. These scattered ions convert the exposedupper portions of the n-type drift region 320 into p-type material thatelectrically connects the deep shielding regions 370 to the p-wells 332,and also increase the p-type doping concentration of the portions of thedeep shielding regions 370 and p-wells 332 that are exposed by theopenings 378. As a result, stripes 371 of p-type material are formed inthe exposed surfaces of the semiconductor layer structure 350. Thesestripes 371 extend in a second direction (the y-direction) to cross thegate trenches 360. Generally speaking, the reflected ions tend toreflect into the lower portions of the exposed sidewalls of the gatetrenches 360, and hence in some cases the stripes 371 may not extendinto the source regions 342 since not enough p-type ions are reflectedinto the exposed portions of the source regions 342, as shown in FIG.4D. As such, the stripes 371 may be discontinuous stripes. The stripes371 of highly doped p-type material therefore electrically connect thedeep shielding regions 370 to the p-wells 332, and hence act as deepshielding connection patterns 372. The ion implant discussed above withreference to FIG. 4C is performed at a high enough dosage to ensure thatthe exposed sidewalls of the source regions 342 are converted tohighly-doped p-type regions so that the stripes 371 of highly dopedp-type material extend all the way to the upper surface of thesemiconductor layer structure 350, as shown in FIG. 4D.

Referring to FIGS. 4E and 4F, gate oxide layers 362 and gate electrodes364 are formed in the gate trenches 360, and an inter-metal dielectriclayer 366, a source contact 380 and a drain contact 382 are then formed.The gate oxide layers 362, gate electrodes 364, inter-metal dielectriclayer 366, source contact 380 and drain contact 382 may be formed in thesame manner as described above with reference to FIGS. 2E and 2F, andhence further description thereof will be omitted. Gate contacts (notshown) may also be formed in a conventional manner. As shown in FIG. 4F,the deep shielding connection patterns 372 do not extend all the waythrough the sidewalls of the gate trenches 360, but instead may onlyextend in a surface region of the sidewalls. Additionally, the deepshielding connection patterns 372 may not extend into the source regions342 in this embodiment.

As with MOSFET 100 of FIGS. 2A-2F, the deep shielding connectionpatterns 372 may occupy only 15%-25% of the surface area of thesidewalls of the gate trenches 260 in example embodiments. In otherembodiments, the extent of the deep shielding connection patterns 372 inthe first direction may be between 10%-30%, between 10% and 40%, between20% and 40% or between 30% and 40% of the extent of the regions of thesidewalls of the gate trenches 260 that are between the deep shieldingconnection patterns 372. All such embodiments may provide improvedperformance as compared to the MOSFET 100 of FIGS. 1A-1D.

FIGS. 4G and 4H illustrate a method of forming a MOSFET 300′ that is amodified version of the MOSFET 300 described above with reference toFIGS. 4A-4F. In particular, FIG. 4G is a schematic perspective view thatcorresponds to FIG. 4A, and FIG. 4H is a schematic perspective view thatcorresponds to FIG. 4A.

As shown in FIG. 4G, in this alternative embodiment, themoderately-doped p-type well layer 330 of FIG. 4A is grown as a thickermoderately-doped p-type well layer 330′, and the heavily-doped (n⁺)n-type silicon carbide source layer 340 of FIG. 4A is replaced with aheavily-doped (n⁺) n-type silicon carbide pattern 340′ that isselectively implanted using an implant mask (not shown) into themoderately-doped p-type well layer 330′. As a result, themoderately-doped p-type well layer 330′ includes a plurality of upwardlyextending stripes 334 that extend to the upper surface of thesemiconductor layer structure 350.

As shown in FIG. 4H, after the processing steps discussed above withreference to FIGS. 4B and 4C are performed, the structure shown in FIG.4H is formed. A lower dosage ion implantation step may be performed sothat the stripes of p-type material that are formed via the scatteringof ions do not extend as far up the sidewalls of the gate trenches 360,and instead may only extend onto the p-wells 332. The above discussedupwardly extending stripes 334 provide the p-type connection to theupper surface of the semiconductor layer structure 350. The MOSFET 300′may otherwise be the same as the MOSFET 300, and hence furtherdescription thereof will be omitted.

FIG. 5A is a schematic cross-sectional view of gate trench power MOSFET400 according to additional embodiments of the present invention, wherethe cross section is taken along the plane defined by the top surface ofthe semiconductor layer structure of the device. FIG. 5B is a schematicperspective view of a small region of the gate trench power MOSFET 400of FIG. 5A (region 402 of FIG. 5A).

As shown in FIG. 5A, a top surface of a semiconductor layer structure450 of the device is shown. A plurality of gate trenches 460 extend inparallel in a first direction across an upper surface of thesemiconductor layer structure 450. A plurality of source trenches 490extend in parallel in a second direction across the upper surface of thesemiconductor layer structure 450. The source trenches 490 are shownextending perpendicularly to the gate trenches 460, but embodiments ofthe present invention are not limited thereto.

Referring to FIG. 5B, the gate trench power MOSFET 400 includes aheavily-doped (n⁺) n-type silicon carbide substrate 410, a lightly-doped(n⁻) silicon carbide drift region 420, a moderately-doped p-type welllayer 430, and a heavily-doped (n⁺) n-type silicon carbide source layer440 that are sequentially stacked. These layers 410, 420, 430, 440 maybe formed in the same fashion and have the same characteristics (e.g.,thickness, doping densities, etc.) as the corresponding layers of gatetrench power MOSFET 100 discussed above, so further description thereofwill be omitted. The substrate 410, drift region 420, well layer 430 andsource layer 440 comprise the semiconductor layer structure 450.

Both the gate trenches 460 and the source trenches 490 extend throughthe source layer 440 to define source regions 442 and through the p-typewell layer 430 to define p-wells 432. The gate trenches 460 and sourcetrenches 490 also extend into the upper surface of the drift region 420.In some embodiments, the gate trenches 460 and the source trenches 490may have the same depth from the upper surface of the semiconductorlayer structure 450 and/or may be formed in the same etching process. Inthis embodiment, the source trenches 490 do not extend all the way tothe gate trenches 460 so that a pillar 404 of semiconductor material isprovided on each side of each gate trench 450 at locations where thegate trench 460 crosses the source trenches 490. The pillars 404 providewalls between each gate trench 490 and its intersecting source trenches490 on which the gate oxide layers may be formed, as discussed below.Each source trench 490 therefore comprises a segmented source trenchthat includes a plurality of collinear spaced-apart segments.

Gate oxide layers 462 and gate electrodes 464 are formed within the gatetrenches 460. The gate oxide layer 462 may be formed by oxidation ordeposition on the bottom surface and sidewalls of each gate trench 460.The gate electrodes 464 are formed on the gate oxide layers 462 to fillthe respective gate trenches 460. The gate oxide layers 462 and gateelectrodes 464 extend continuously through the respective gate trenches460 in the depicted embodiment. Respective protrusions 484 of a sourcecontact 480 are formed within the respective source trenches 490. Thesource contact 480 may be a monolithic source contact 480 in someembodiments that includes downward protrusions 484 that extend into therespective source trenches 490. FIG. 5B does not show the portion of thesource contact 480 that is above the protrusions 484 and only depictstwo of the downward protrusions 484 that extend into first and secondportions of a segmented source trench 490. It will be appreciated thatan inter-metal insulation pattern (not shown) is provided on the topsurface of the semiconductor layer structure and the gate electrodesthat isolates the gate electrodes 464 from the source contact 480, andthat the protrusions 484 of source contact 480 extend through openingsin this inter-metal insulation pattern to fill the source trenches 490.It will also be appreciated that the MOSFET 400 will include connections(not shown) between each gate electrode 464 and a gate terminal (notshown) and will also include a drain contact (not shown) on the bottomof the semiconductor substrate 410.

As is further shown in FIG. 5B, heavily-doped p⁺ silicon carbide deepshielding regions 492 are formed underneath each source trench 490. Thedeep shielding regions 492 may be formed by implanting p-type dopantsinto the bottom surface of each source trench 490 before the sourcecontact 480 (including protrusions 484) is formed. The p-type shieldingpatterns 492 may be formed via a high energy, high dosage ionimplantation step that converts the portions of the lightly-doped n-typedrift region 420 that are under the source trenches 490 into heavilydoped p-type regions.

As is also shown in FIG. 5B, heavily-doped p⁺ silicon carbide deepshielding regions 470 may optionally be formed underneath each gatetrench 460. The deep shielding regions 470 may be formed by implantingp-type dopants into the bottom surface of each gate trench 490 beforegate oxide layers 462 and gate electrodes 464 are formed within the gatetrenches 460. The p-type shielding patterns 470 may be formed via a highenergy, high dosage ion implantation step that converts the portions ofthe lightly-doped n-type drift region 420 that are under the gatetrenches 460 into heavily doped p-type regions. The deep shieldingregions 492 and the deep shielding regions 470 (if provided) may beformed via the same ion implantation process.

The bottom portions of the pillars 404 that are interposed between thegate trenches 460 and the source trenches 490 may be implanted withp-type ions during the ion implantation process in order to convert thebottom portions of the pillars to p-type material in order to provide anelectrical connection between the deep shielding regions 492 and thedeep shielding regions 470 (if provided). In some cases, the bottomportions of the pillars 404 (an the region underneath each pillar 404)may be sufficiently implanted with p-type ions to provide theseelectrical connections based on the straggle of the high energy p-typeimplant. In other cases, angled ion implants may be used to ensure thatthe bottom portions of the pillars 404 are converted to p-type material.Of course, if the deep shielding regions 470 are not provided, thenthere may be no reason to convert the bottom portions of the pillars 404to p-type material.

The MOSFET 400 does not include any deep shielding connection patterns,as the source contact 480 directly contacts the deep shielding regions492, and the deep shielding regions 492 directly contact the deepshielding regions 470. In effect, the deep shielding regions 492 serveas both deep shielding regions and also serve as deep shieldingconnection patterns that electrically connect the deep shielding regions470 to the source contact 480. As noted above, the deep shieldingregions 470 may be omitted in some embodiments.

The portions of the gate trenches 460 that border the source trenches490 (i.e., the pillars 404) will not have semiconductor channel regionstherein in cases where the bottom portions of the pillars are convertedto p-type material. It is anticipated that the pitch of the sourcetrenches 490 may be such that only about 15%-25% of the surface area ofthe sidewalls of the gate trenches 460 will be adjacent source trenches490. Thus, the MOSFET 400 may also exhibit improved performance ascompared to the conventional MOSFET 1 of FIGS. 1A-1E.

FIGS. 5C and 5D illustrate two modified embodiments 400B and 400C,respectively, of the MOSFET 400A of FIGS. 5A-5B. FIGS. 5C and 5D eachcorrespond to the view of FIG. 5B.

As shown in FIG. 5C, the MOSFET 400B is similar to the MOSFET 400A shownin FIG. 5B. The primary difference between the two devices is thatMOSFET 400A includes continuous gate trenches 460, gate dielectriclayers 462 and gate electrodes 464 and segmented source trenches 490 andsource contact protrusions 484, while MOSFET 400B includes continuoussource trenches 490, and source contact protrusions 484 and segmentedgate trenches 460, gate dielectric layers 462 and gate electrodes 464.As shown in FIG. 5D, MOSFET 400C combines the approach of segmenting thesource trenches 490 and source contact protrusions 484 (as done inMOSFET 400A) and segmenting the gate trenches 460, gate dielectric layer462 and gate electrodes 464 (as done in MOSFET 400B). As such, furtherdescription of these devices will be omitted.

FIGS. 6A-6E are schematic cross-sectional views that illustrate a methodof fabricating a gate trench power MOSFET 500 according to still furtherembodiments of the present invention.

As shown in FIG. 6A, a semiconductor layer structure 550 may be formedthat includes a heavily-doped (n⁺) n-type silicon carbide substrate 510,a lightly-doped (n⁻) silicon carbide drift region 520, and amoderately-doped silicon carbide p-wells 532. Heavily-doped n⁺ siliconcarbide source regions 542 are formed in upper portions of the p-wells532. Gate trenches 560 are formed in the upper surface of thesemiconductor layer structure 550 in a conventional manner. Deepshielding regions 570 are formed via ion implantation underneath thegate trenches 560. The structure shown in FIG. 6A may be identical tothe structure of the conventional MOSFET 1 discussed above withreference to FIG. 1B, and hence further description thereof will beomitted.

Referring to FIG. 6B, gate dielectric layers 562 are formed that coverthe sidewalls and bottom surfaces of the gate trenches 560. The gatedielectric layers 562 may also extend onto the top surface of thesemiconductor layer structure 550. Gate electrodes are then formed tofill the trenches 560. A mask (not shown) is then formed and the gatedielectric layers 562 and gate electrodes are etched to form preliminarysource trenches 591 that expose central portions of the deep shieldingregions 570 (i.e., central sections of the gate trenches 560 arereopened). The preliminary source trenches 591 may be continuous (i.e.,they may extend the full lengths of the respective gate trenches) or maybe discontinuous (they are shown as being continuous in FIG. 6B). Thepreliminary source trenches 591 may divide each gate electrode intofirst and second gate electrodes 564-1, 564-2.

Referring to FIG. 6C, an inter-metal insulating pattern 566 is thenformed that fills the preliminary source trenches 591 and that coversexposed portions of the gate electrodes 564-1, 564-2.

Referring to FIG. 6D, an etch mask (not shown) is formed and theinter-metal insulation pattern 566 is etched to form source trenches590. Each source trench 590 extends through the center of a respectivegate trench 560 to expose the deep shielding regions 570.

Referring to FIG. 6E, the source contact 580 is formed on the uppersurface of the device. The source contact 580 includes downwardprotrusions 584 that fill the source trenches 590. The protrusions 584directly contact the deep shielding regions 570 and hence provide adirect electrical connection between the source contact 580 and the deepshielding regions 570, eliminating any need for a separate deepshielding connection pattern.

By configuring the source contact 580 to extend through the gate trench560 to directly contact the deep shielding regions 570, any need for adeep shielding connection pattern may be eliminated. In the depictedembodiment, each downward protrusion 584 of the source contact 580extends the full length of the respective gate trench 560 in which itresides, and hence the first and second gate electrodes 564-1, 564-2 maybe separate contacts that are only electrically connected to each otheroutside of the gate trenches 560. In other embodiments, the downwardprotrusions 584 may comprise plugs that do not extend the full length ofthe respective gate trench 560. In such embodiments, the first andsecond gate electrodes 564-1, 564-2 may be electrically connected toeach other within the portions of the gate trenches 560 that do notinclude the plugs 584.

FIGS. 7-9 are flow charts that illustrate methods of fabricating gatetrench power semiconductor devices according to embodiments of thepresent invention.

With reference to FIG. 7 and FIGS. 2A-4F, operations may begin withformation of a wide band-gap semiconductor layer structure (Block 600).The semiconductor layer structure may include a substrate and aplurality of semiconductor layers that are grown on the substrate byepitaxial growth and/or formed by ion implantation. The semiconductorlayer structure may include a drift region that has a first conductivitytype. The semiconductor layer structure may further include well regionshaving a second conductivity type on the drift region and source regionshaving the first conductivity type in upper portions of the wellregions. A gate trench is formed in an upper surface of thesemiconductor layer structure (Block 610). The gate trench may extend ina first direction and may have a bottom surface, a first sidewall thatextends in the first direction and a second sidewall that extends in thefirst direction.

A deep shielding region having the second conductivity type is formed inthe semiconductor layer structure underneath the bottom surface of thegate trench (Block 620). The deep shielding region may be formed by ionimplantation. A plurality of spaced-apart deep shielding connectionpatterns are formed that extend in a second direction to cross the deepshielding pattern (Block 630). In some embodiments, the second directionmay be perpendicular to the first direction. Channel regions may bedefined in the sidewalls of the gate trench between the deep shieldingconnection patterns.

With reference to FIG. 8 and FIGS. 5A-5D, operations may begin withformation of a wide band-gap semiconductor layer structure (Block 700).The semiconductor layer structure may include a substrate and aplurality of semiconductor layers that are grown on the substrate byepitaxial growth and/or formed by ion implantation. The semiconductorlayer structure may include a drift region that has a first conductivitytype. The semiconductor layer structure may further include well regionshaving a second conductivity type on the drift region and source regionshaving the first conductivity type in upper portions of the wellregions. A plurality of gate trenches are formed in an upper surface ofthe semiconductor layer structure (Block 710). The gate trenches mayextend in a first direction and may be spaced apart from each other in asecond direction that is perpendicular to the first direction. Each gatetrench may have a bottom surface, a first sidewall that extends in thefirst direction and a second sidewall that extends in the firstdirection.

A plurality of source trenches are also formed in an upper surface ofthe semiconductor layer structure (Block 720). The source trenches crossthe gate trenches and may extend in the second direction in someembodiments. The gate trenches and source trenches can be formed using acommon etching process. A plurality of deep shielding regions having thesecond conductivity type are formed in the semiconductor layer structureunderneath the bottom surface of the source trench (Block 730). The deepshielding regions may be formed by ion implantation. Deep shieldingregions may optionally be formed underneath the respective gatetrenches.

With reference to FIG. 9 and FIGS. 6A-6E, operations may begin withformation of a wide band-gap semiconductor layer structure (Block 800).The semiconductor layer structure may include a substrate and aplurality of semiconductor layers that are grown on the substrate byepitaxial growth and/or formed by ion implantation. The semiconductorlayer structure may include a drift region that has a first conductivitytype. The semiconductor layer structure may further include well regionshaving a second conductivity type on the drift region and source regionshaving the first conductivity type in upper portions of the wellregions. A gate trench is formed in an upper surface of thesemiconductor layer structure (Block 810). The gate trench may extend ina first direction and may have a bottom surface, a first sidewall thatextends in the first direction and a second sidewall that extends in thefirst direction.

A deep shielding region having the second conductivity type is formed inthe semiconductor layer structure underneath the bottom surface of thegate trench (Block 820). The deep shielding region may be formed by ionimplantation. The deep shielding region may be formed by ionimplantation. A first gate electrode is formed on the first sidewall ofthe gate trench (Block 830) and a second gate electrode is formed on thesecond sidewall of the gate trench (Block 840). The first and secondgate electrodes may be formed as a monolithic gate electrode, and atleast some of a middle portion of the monolithic gate electrode may beremoved. A source contact is formed between the first and second gateelectrodes (Block 850). The source contact may directly contact the deepshielding region.

In the description above, each example embodiment has a certainconductivity type. It will be appreciated that opposite conductivitytype devices may be formed by simply reversing the conductivity of then-type and p-type layers in each of the above embodiments. Thus, it willbe appreciated that the present invention covers both n-channel andp-channel devices for each different device structure (e.g., MOSFET,IGBT, etc.). Herein, where a contact can be either a source contact or adrain contact it may be referred to as a “source/drain contact.”

While the present invention is described above with respect to powerMOSFET and power IGBT implementations, it will be appreciated that thetechniques described herein apply equally well to other similar verticalpower devices having a gate trench. Thus, embodiments of the presentinvention are not limited MOSFETs and IGBTs, and the techniquesdisclosed herein may be used on any appropriate gate trench device.

The present invention has primarily been discussed above with respect tosilicon carbide based power semiconductor devices. It will beappreciated, however, that silicon carbide is used herein as an exampleand that the devices discussed herein may be formed in any appropriatewide band-gap semiconductor material system. As an example, galliumnitride based semiconductor materials (e.g., gallium nitride, aluminumgallium nitride, etc.) may be used instead of silicon carbide in any ofthe embodiments described above.

It will also be appreciated that the different features of the differentembodiments described herein may be combined to provide additionalembodiments. For example, it was discussed above with respect to oneembodiment that junction termination extensions could be used in placeof guard rings. This is true in each embodiment disclosed herein.Likewise, the shield regions under the gate trenches may be included oromitted in any of the embodiments. Any of the embodiments may alsoinclude well regions that have varying dopant concentrations includinglower doped channel regions.

Embodiments of the present invention have been described above withreference to the accompanying drawings, in which embodiments of theinvention are shown. It will be appreciated, however, that thisinvention may, however, be embodied in many different forms and shouldnot be construed as limited to the embodiments set forth above. Rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the scope of the invention to thoseskilled in the art. Like numbers refer to like elements throughout.

It will be understood that, although the terms first, second, etc. areused throughout this specification to describe various elements, theseelements should not be limited by these terms. These terms are only usedto distinguish one element from another. For example, a first elementcould be termed a second element, and, similarly, a second element couldbe termed a first element, without departing from the scope of thepresent invention. The term “and/or” includes any and all combinationsof one or more of the associated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”“comprising,” “includes” and/or “including” when used herein, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present. Itwill also be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

Relative terms such as “below” or “above” or “upper” or “lower” or “top”or “bottom” may be used herein to describe a relationship of oneelement, layer or region to another element, layer or region asillustrated in the figures. It will be understood that these terms areintended to encompass different orientations of the device in additionto the orientation depicted in the figures.

Embodiments of the invention are described herein with reference tocross-section illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of the invention.The thickness of layers and regions in the drawings may be exaggeratedfor clarity. Additionally, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Embodiments of the invention arealso described with reference to a flow chart. It will be appreciatedthat the steps shown in the flow chart need not be performed in theorder shown.

Some embodiments of the invention are described with reference tosemiconductor layers and/or regions which are characterized as having aconductivity type such as n-type or p-type, which refers to the majoritycarrier concentration in the layer and/or region. Thus, n-type materialhas a majority equilibrium concentration of negatively chargedelectrons, while p-type material has a majority equilibriumconcentration of positively charged holes. Some material may bedesignated with a “+” or “−” (as in n+, n−, p+, p−, n++, n−−, p++, p−−,or the like), to indicate a relatively larger (“+”) or smaller (“−”)concentration of majority carriers compared to another layer or region.However, such notation does not imply the existence of a particularconcentration of majority or minority carriers in a layer or region.

In the drawings and specification, there have been disclosed typicalembodiments of the invention and, although specific terms are employed,they are used in a generic and descriptive sense only and not forpurposes of limitation, the scope of the invention being set forth inthe following claims.

That is which claimed is:
 1. A power semiconductor device comprising: asemiconductor layer structure comprising a drift region that comprises awide band-gap semiconductor material, the drift region having a firstconductivity type; a gate trench in the semiconductor layer structure,the gate trench having a longitudinal axis that extends in a firstdirection and comprising first and second opposed sidewalls that extendparallel to the longitudinal axis; first and second well regions havinga second conductivity type that is different from the first conductivitytype in the semiconductor layer structure above the drift region, thefirst well region comprising part of the first sidewall and the secondwell region comprising part of the second sidewall; a deep shieldingregion having the second conductivity type in the semiconductor layerstructure and extending continuously underneath the gate trench for thefull length of the gate trench; and a plurality of deep shieldingconnection patterns that have the second conductivity type in thesemiconductor layer structure, the deep shielding connection patternsspaced apart from each other along the first direction, the deepshielding connection patterns establishing part of the first sidewall ofthe gate trench and establishing part of the second sidewall of the gatetrench, wherein the deep shielding connection patterns electricallyconnect the deep shielding region to the first and second well regions,and wherein the deep shielding connection patterns have higher secondconductivity type dopant concentrations than do the first and secondwell regions.
 2. The power semiconductor device of claim 1, furthercomprising first and second source regions having the first conductivitytype on top of the respective first and second well regions.
 3. Thepower semiconductor device of claim 1, wherein the deep shieldingconnection patterns extend to an upper surface of the semiconductorlayer structure.
 4. The power semiconductor device of claim 1, whereinthe deep shielding connection patterns sub-divide the first sourceregion into a plurality of spaced apart segments and sub-divide thesecond source region into a plurality of spaced apart segments.
 5. Thepower semiconductor device of claim 1, wherein portions of the deepshielding region that are aligned along the second direction with therespective deep shielding connection patterns have higher dopingconcentrations of second conductivity type dopants than do a remainderof the deep shielding region.
 6. The power semiconductor device of claim1, further comprising: a gate insulation layer in the gate trench thatcovers a bottom surface and the first and second sidewalls of the gatetrench; a gate electrode in the gate trench on the gate insulationlayer; a first source/drain contact that directly contacts the firstsource region, the second source region and the deep shieldingconnection patterns; and a second source/drain contact on a lowersurface of the semiconductor layer structure.
 7. The power semiconductordevice of claim 1, wherein the wide band-gap semiconductor comprisessilicon carbide.
 8. The power semiconductor device of claim 1, furthercomprising: an additional plurality of gate trenches in the upperportion of the semiconductor layer structure, each of the additionalplurality of gate trenches comprising respective first and secondopposed sidewalls that extend in the first direction; an additionalplurality of deep shielding regions having the second conductivity typein the semiconductor layer structure underneath the respectiveadditional plurality of gate trenches; wherein each of the deepshielding connection patterns extends continuously in the seconddirection and is formed in both the first sidewall and the secondsidewall of each of the respective additional plurality of gatetrenches; and an additional plurality of semiconductor channel regionsthat have the second conductivity type in the first and second sidewallsof the respective additional plurality of gate trenches, thesemiconductor channel regions positioned between adjacent deep shieldingconnection patterns in each of the additional plurality of gatetrenches.
 9. The power semiconductor device of claim 1, wherein thefirst and second well regions do not extend to the upper surface of thesemiconductor layer structure.
 10. A power semiconductor devicecomprising: a semiconductor layer structure comprising a drift regionthat comprises a wide band-gap semiconductor material, the drift regionhaving a first conductivity type; a gate trench in an upper portion ofthe semiconductor layer structure, the gate trench having a longitudinalaxis that extends in a first direction and comprising first sidewall anda second sidewall opposite the first sidewall, the first and secondsidewalls extending parallel to the longitudinal axis; first and secondwell regions having a second conductivity type that is different fromthe first conductivity type in the semiconductor layer structure abovethe drift region, the first well region comprising part of the firstsidewall and the second well region comprising part of the secondsidewall; a deep shielding region having the second conductivity type inthe semiconductor layer structure underneath the gate trench; and aplurality of deep shielding connection patterns that have the secondconductivity type in the semiconductor layer structure, the deepshielding connection patterns spaced apart from each other along thefirst direction, the deep shielding connection patterns extending in asecond direction that is different from the first direction, at leastsome of the deep shielding connection patterns establishing part of thefirst sidewall and establishing part of the second sidewalk, wherein thedeep shielding connection patterns electrically connect the deepshielding region to the first and second well regions and have a higherdoping concentration than the first and second well regions, and whereinthe first and second well regions do not extend to an upper surface ofthe semiconductor layer structure.
 11. The power semiconductor device ofclaim 2, wherein the deep shielding region extends continuouslyunderneath the gate trench for the full length of the gate trench.
 12. Apower semiconductor device comprising: a semiconductor layer structurecomprising a drift region that comprises a wide band-gap semiconductormaterial, the drift region having a first conductivity type; a gatetrench in an upper portion of the semiconductor layer structure, thegate trench having a longitudinal axis that extends in a first directionand comprising first and second opposed sidewalls that each extend inthe first direction; a first gate electrode on the first sidewall of thegate trench; a second gate electrode on the second sidewall of the gatetrench; a deep shielding region having a second conductivity type thatis different from the first conductivity type in the semiconductor layerstructure underneath the gate trench, the deep shielding region defininga bottom surface of the gate trench; and a source contact in the gatetrench between the first and second gate electrodes, wherein a portionof the source contact that is within the gate trench directly contactsthe deep shielding region.
 13. The power semiconductor device of claim12, further comprising a first gate dielectric layer between the firstsidewall of the gate trench and the first gate electrode; and a secondgate dielectric layer between the second sidewall of the gate trench andthe second gate electrode.
 14. The power semiconductor device of claim12, further comprising: a first inter-metal dielectric layer that is inthe gate trench between the first gate electrode and the source contact;and a second inter-metal dielectric layer that is in the gate trenchbetween the second gate electrode and the source contact.
 15. A powersemiconductor device comprising: a semiconductor layer structurecomprising a drift region, the drift region having a first conductivitytype; a gate trench in the semiconductor layer structure, the gatetrench having a longitudinal axis that extends in a first direction andcomprising first and second opposed sidewalls that extend parallel tothe longitudinal axis; first and second well regions having a secondconductivity type that is different from the first conductivity type inthe semiconductor layer structure, the first well region comprising partof the first sidewall and the second well region comprising part of thesecond sidewall; a deep shielding region having the second conductivitytype in the semiconductor layer structure underneath the gate trench;and a plurality of deep shielding connection patterns that have thesecond conductivity type in the semiconductor layer structure, the deepshielding connection patterns spaced apart from each other along thefirst direction, the deep shielding connection patterns extending in asecond direction that is different from the first direction, wherein atleast some of the deep shielding connection patterns extend ascontinuous stripes in the second direction underneath both the gatetrench and at least one additional gate trench in the semiconductorlayer structure, and wherein the deep shielding connection patterns havehigher second conductivity type dopant concentrations than do the firstand second well regions.
 16. The power semiconductor device of claim 15,wherein the deep shielding connection patterns extend to an uppersurface of the semiconductor layer structure.
 17. The powersemiconductor device of claim 16, wherein the first and second wellregions do not extend to the upper surface of the semiconductor layerstructure.
 18. A power semiconductor device comprising: a semiconductorlayer structure comprising a drift region that comprises a wide band-gapsemiconductor material, the drift region having a first conductivitytype; a gate trench in the semiconductor layer structure, the gatetrench having a longitudinal axis that extends in a first direction andcomprising first and second opposed sidewalls that each extend parallelto the longitudinal axis; first and second well regions having a secondconductivity type that is different from the first conductivity type inthe semiconductor layer structure, the first well region comprising partof the first sidewall and the second well region comprising part of thesecond sidewall; a deep shielding region having the second conductivitytype in the semiconductor layer structure underneath the gate trench;and a plurality of deep shielding connection patterns that have thesecond conductivity type in the semiconductor layer structure, the deepshielding connection patterns spaced apart from each other along thefirst direction, the deep shielding connection patterns extending in asecond direction that is different from the first direction, wherein thedeep shielding connection patterns electrically connect the deepshielding region to the first and second well regions, and whereinportions of the deep shielding region that are aligned along the seconddirection with the respective deep shielding connection patterns havehigher doping concentrations of second conductivity type dopants than doa remainder of the deep shielding region.
 19. A power semiconductordevice comprising: a semiconductor layer structure comprising a driftregion that has a first conductivity type; a gate trench in thesemiconductor layer structure, the gate trench having a longitudinalaxis that extends in a first direction; a first well region and a secondwell region in the semiconductor layer structure on respective sides ofthe gate trench, the first and second well regions having a secondconductivity type that is different from the first conductivity type;first and second source regions having the first conductivity type ontop of the respective first and second well regions; a deep shieldingregion having the second conductivity type in the semiconductor layerstructure underneath the gate trench; and a deep shielding connectionpattern that has the second conductivity type in the semiconductor layerstructure, the deep shielding connection pattern extending onto topsurfaces of the respective first and second source regions.
 20. Thepower semiconductor device of claim 19, wherein the deep shieldingregion extends continuously underneath the gate trench for the fulllength of the gate trench.
 21. The power semiconductor device of claim19, further comprising a plurality of additional deep shieldingconnection patterns, the deep shielding connection pattern and theplurality of additional deep shielding connection patterns spaced apartfrom each other along the first direction and extending in a seconddirection that is different from the first direction.
 22. The powersemiconductor device of claim 19, wherein the deep shielding connectionpattern electrically connects the deep shielding region to the first andsecond well regions and has a higher second conductivity type dopantconcentrations than do the first and second well regions.